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GlobalSubmit Showcases New eCTD Applications At DIA EDM Conference in Philadelphia
 

 

GlobalSubmit VALIDATE V5 Debuts At 21st Annual EDM Meeting

FOR IMMEDIATE RELEASE, Philadelphia, PA—January 30, 2008. GlobalSubmit Inc., a leading developer of software designed exclusively for the review and validation of eCTD global submissions, today announced it's presence at the upcoming 21 Annual DIA EDM Conference held at the Philadelphia Marriott.  DIA's EDM conferences have traditionally focused on the life science industry's move toward electronic information exchange and the wave of standards and initiatives to support this transformation. 

 

At this years' meeting, GlobalSubmit will showcase its flagship applications including a new release of GlobalSubmit VALIDATE version 5.0 which includes an all-new web interface.  In response to increasing worldwide adoption for the eCTD, GlobalSubmit VALIDATE V5 supports U.S., European, Canadian, and the rest of the world (ROW) submissions.  Also, as next generation Regulated Product Submissions (RPS) increase adoption among sponsor organizations, V5 now includes support for RPS.

 

In response to the release of the new application, Rahul Mistry, CEO of GlobalSubmit commented, "This DIA event is our biggest ever.  In keeping with our mission to promote the adoption of the eCTD format, we are rolling out an enterprise-ready solution for the validation of eCTD's.  We hope that this product, coupled with our professional services offerings will add momentum to the adoption and implementation of global submissions based on the eCTD format."

 

Mr. Mistry continued, "our new release also supports emerging standards such as RPS.  GlobalSubmit has been an active participant in the RPS initiative and includes built-in support for this crucial standard in our new market offerings."

 

GlobalSubmit VALIDATE supports a 3-tier architecture including an enterprise database as its foundation.  The new application will support both Oracle and Microsoft SQL Server databases. 

 

Visit GlobalSubmit at booth 505 at the DIA Conference.


 

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